PRECISION PROCESSING OF GLASS BY LASER
DESCRIPTION, INNOVATION AND ADVANTAGES
Laser-based techniques such as rear side glass processing can offer high quality and throughput, which can be used for glass drilling, cutting and milling applications. The laser milled feature sizes can be reduced to 150 µm. Laser cuts are taper-less, extremely high aspect ratio features can be fabricated. Laser-based processing can maintain high throughput with the highest processing quality keeping surface chipping below 100 µm.
Materials: soda-lime glass (SLG), fused silica, BK7 glass, borosilicate glass;
Quality: Surface chipping <100 µm, sidewall roughness <2 µm;
Cutting throughput: 0.6 m/min (1 mm SLG glass), 0.12 m/min (5 mm SLG glass);
Via drilling Ø 0.2-1 mm: 1 s/via (1 mm SLG), 5 s/via (5 mm SLG);
Material removal rate: >90 mm3/min.
CURRENT STAGE OF DEVELOPMENT
Technology validated in small series production.
INTELLECTUAL PROPERTIES RIGHTS STATUS
Know-how and design rules.
TYPE AND ROLE OF PARTNER SOUGHT
Hi-tech photonics companies, producing specialized components from glass.
Value proposition
Our laser-based technology offers precision and efficiency in glass processing. With high-quality cuts as small as 150 µm and minimal surface chipping <100 µm, we ensure top-notch quality while maintaining high throughput.
