LASER-INDUCED SELECTIVE PLATING OF DIELECTRICS FOR ELECTRONIC CIRCUIT FABRICATION
DESCRIPTION, INNOVATION AND ADVANTAGES
Electric circuit traces formation on 3D shaped dielectrics is one of the biggest challenges in 3D Mechatronic Integrated Devices (3D-MID). The advanced technology of Selective Surface Activation Induced by a Laser (SSAIL) can solve emerged production issues for electric traces. The process can be applied almost on any commercial dielectric material by adapting laser and chemical parameters. Narrow copper lines below one micrometre in a width are feasible to produce. The technology is capable to fabricate a metallic mesh with metal wires less than 5 µm in diameter to be invisible but still electro-conductive. Therefore, such metallic mesh can substitute Indium Tin Oxide (ITO) in the transparent conductive film market.
CURRENT STAGE OF DEVELOPMENT
Ready for the integration in production lines.
INTELLECTUAL PROPERTIES RIGHTS STATUS
Patented (WO 2018051210; JP 6749482; LT 6518; US 10982328; EP 3512980; CN 109844178; KR 102319221)
TYPE AND ROLE OF PARTNER SOUGHT
Industrial Electronics manufacturers.
Value proposition
The SSAIL technology transforms the 3D-MID production by enabling efficient formation of electric circuit traces on 3D dielectrics and fabricating nearly invisible, electro-conductive metallic mesh, positioning it as a potential Indium Tin Oxide substitute in the transparent conductive film market.
